

Renesas TSE2002GB2A1NCG
Manufacturer No:
TSE2002GB2A1NCG
Manufacturer:
Package:
DFN
Description:
DFN Thermal Management 2mm mm Lead Free
Quantity:
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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TSE2002GB2A1NCG Information
Renesas TSE2002GB2A1NCG technical specifications, attributes, parameters and parts with similar specifications to Renesas TSE2002GB2A1NCG.
- Type
- Parameter
- Mount
- Surface Mount
- Package / Case
- DFN
- Number of Pins
- 8
- Published
- 2004
- JESD-609 Code
- e3
- Pbfree Code
- yes
- Terminal Finish
- Matte Tin (Sn)
- Max Operating Temperature
- 125°C
- Min Operating Temperature
- -20°C
- Pin Count
- 8
- Type
- Parameter
- Output Type
- Digital, I2C
- Interface
- 2-Wire, I2C, SMBus
- Termination Type
- SOLDER
- Operating Supply Current
- 700?A
- Number of Bits
- 12
- Resolution
- 1 B
- Sensors/Transducers Type
- TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
- Max Supply Voltage (DC)
- 3.6V
- Min Supply Voltage (DC)
- 2.3V
- Accuracy-Max
- 3 Cel
Download datasheets and manufacturer documentation for Renesas TSE2002GB2A1NCG.
TSE2002GB2A1NCG Overview
As an output type, it uses Digital, I2C.As a result of its low package cost, the DFN is familiar to electronics professionals.8 pins are equipped with it.There is a possibility of storing information in 12 bits.The SOLDER termination type minimies signal reflections and power losses.Until a waveform reaches 1 B, the resolution is defined as the distance in amplitude at which two points can be distinguished.Thermal management operates with Thermal managementh 700?A current.3.6V is the maximum supply voltage (DC) it can handle.Using DC supply voltage (2.3V), it operates.Keeping the Operating Temperature below 125°C will prevent unneeded costs. Operating temperatures should be above -20°C to avoid unnecessary expenses.
TSE2002GB2A1NCG Features
Available in the DFN package
Operating supply current of 700?A
TSE2002GB2A1NCG Applications
There are a lot of Integrated Device Technology (IDT)
TSE2002GB2A1NCG applications of thermal management.
- Industrial Equipment
- PCs and Notebooks
- Data Storage
- Data Communications Equipment
- Instrumentation
- Workstations
- Servers
- Networking
- Telecommunications
- Desktop Computers
TSE2002GB2A1NCG Relevant information
The following parts are popular search parts in Integrated Circuits (ICs).
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