STMicroelectronics STM32WB07CCF6TR
Manufacturer No:
STM32WB07CCF6TR
Manufacturer:
STMicroelectronics
Package:
Description:
Ultra-low-power, Arm Cortex-M0+ MCU 64 MHz with 256 Kbytes of Flash memory, 64 Kbytes of RAM, Bluetooth LE 5.4
Quantity:
In Stock :4297
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Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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STM32WB07CCF6TR Information
STMicroelectronics STM32WB07CCF6TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics STM32WB07CCF6TR.
- Type
- Parameter
- Supply Voltage Min Volt
- 1.7
- Supply Voltage Max Volt
- 3.6
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- Core
- Arm Cortex-M0+
- ECCN US
- 5A992.c
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Type
- Parameter
- Package Name
- WLCSP MSL1
- Supply Voltage Min Volt
- 1.7
- Supply Voltage Max Volt
- 3.6
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- Core
- Arm Cortex-M0+
- ECCN US
- 5A992.c
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
Download datasheets and manufacturer documentation for STMicroelectronics STM32WB07CCF6TR.
Data sheet:
The STM32WB0xxC is an ultra-low-power programmable Bluetooth® LE wireless SoC solution. It embeds STMicroelectronics state-of-art 2.4 GHz RF radio IPs combining unparalleled performance with extremely long‑battery lifetime. It is compliant with Bluetooth® LE addressing point‑to‑point connectivity and Bluetooth® Mesh networking and allows large-scale device networks to be established in a reliable way. The STM32WB0xxC is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra‑low latency applications.
The STM32WB0xxC embeds a Cortex®‑M0+ microcontroller that can operate up to 64 MHz and also the BlueNRG core coprocessor (DMA based) for Bluetooth® LE timing critical operations.
In addition, the STM32WB0xxC provides enhanced security hardware support by dedicated hardware functions:
True random number generator (RNG), encryption AES maximum 128-bit security coprocessor, public key accelerator (PKA), CRC calculation unit, 64-bit unique ID, flash memory read and write protection.
The STM32WB0xxC can be configured to support standalone or network processor applications. In the first configuration, the STM32WB0xxC operates as a single device in the application for managing both the application code and the Bluetooth® LE stack.
The STM32WB0xxC embeds high-speed and flexible memory types: flash memory of 256 Kbytes, RAM memory of 64 Kbytes, one-time-programmable (OTP) memory area of 1 Kbyte, ROM memory of 7 Kbytes (ST reserved area).
Direct data transfer between memory and peripherals and from memory-to-memory is supported by eight DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
The STM32WB0xxC embeds a 12-bit ADC, allowing measurements of up to eight external sources and up to three internal sources, including battery monitoring and a temperature sensor.
The STM32WB0xxC has a low-power RTC and one advanced 16-bit timer.
The STM32WB0xxC features standard and advanced communication interfaces:
1x SPI, 2x SPI/I2S, 1x LPUART, 1x USART supporting ISO 7816 (smartcard mode), IrDA, and modbus mode, 2x I2C supporting SMBus/PMBus, 1x channel PDM.
The STM32WB0xxC operates in the -40 to +105°C temperature range from a 1.7 V to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
The STM32WB0xxC integrates a high efficiency SMPS step-down converter and an integrated PDR circuitry with a fixed threshold that generates a device reset when the VDD drops under 1.65 V.
The STM32WB0xxC comes in different package versions supporting up to:
32 I/Os for the VFQFPN48 package, 20 I/Os for the VFQFPN32 package, 30 I/Os for the WLCSP49 package.
- Includes ST state-of-the-art patented technology.
- Bluetooth® LE
- LE 2M
- LE coded
- Extended advertising
- LE channel classification
- LE data packet length extension
- LE secure connections
- Link layer privacy
- Periodic advertising
- Periodic advertising with responses
- Advertising coding selection
- Encrypted advertising data
- LE L2CAP connection-oriented channel
- LE power control
- Enhanced attribute protocol
- Connection subrating
- Isochronous channels
- Qualified against Bluetooth® core 5.4
- Radio
- Rx sensitivity level: -97 dBm @ 1 Mbps, -104 dBm @ 125 kbps (long range)
- Programmable output power up to +8 dBm (at antenna connector)
- Data rate supported: 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
- 128 physical connections
- Integrated balun
- Support for external PA
- STM32WB0xxC core coprocessor (DMA based) for Bluetooth® LE timing critical operation
- 2.4 GHz proprietary radio driver
- Suitable for systems requiring compliance with the following radio frequency regulations: ETSI EN 300 328, EN 300 440, FCC CFR47 part 15, ARIB STD-T66
- Available integrated passive device (IPD) companion chip for optimized matching and filtering
- Ultra-low-power features (ultra-low-power devices)
- 10 nA in Shutdown mode (1.8 V)
- 0.6 μA in Deepstop mode (with external LSE and Bluetooth® LE wake-up sources, 1.8 V)
- 0.9 μA in Deepstop mode (with internal LSI and Bluetooth® LE wake-up sources, 1.8 V)
- 4.3 mA peak current in Tx (@ 0 dBm, 3.3 V)
- 3.4 mA peak current in Rx (@ sensitivity level, 3.3 V)
- High performance and ultralow power Arm® Cortex®-M0+ 32-bit, running up to 64 MHz
- Dynamic current consumption: 16.5 μA/MHz
- Operating supply voltage: from 1.7 to 3.6 V
- Security
- Flash read/write protection
- SWD disabling
- Secure bootloader
- True random number generator (RNG)
- Hardware encryption AES maximum 128-bit security coprocessor
- Hardware public key accelerator (PKA)
- CRC calculation unit
- 64-bit unique ID
- Clock management
- High-efficiency embedded SMPS step-down converter with intelligent bypass mode
- Ultra-low-power power-on-reset (POR) and power-down-reset (PDR)
- Programmable voltage detector (PVD)
- Fail-safe 32 MHz crystal oscillator with integrated trimming capacitors
- 32 kHz crystal oscillator
- Internal low-power 32 kHz RO
- Memories
- On-chip nonvolatile flash memory of 256 Kbytes
- On-chip RAM of 64 Kbytes or 32 Kbytes
- One-time-programmable (OTP) memory area of 1 Kbyte
- Embedded UART bootloader
- Ultra-low-power modes with or without timer and RAM retention
- System peripherals
- 1x DMA controller with eight channels supporting ADC, SPI, I2C, USART, and LPUART
- 1x SPI
- 2x SPI/I2S
- 2x I2C (SMBus/PMBus)
- 1x PDM (digital microphone interface)
- 1x LPUART
- 1x USART (ISO 7816 smartcard mode, IrDA, SPI controller, and modbus)
- 1x independent WDG
- 1x real-time clock (RTC)
- 1x independent SysTick
- 1x 16-bit, six channel advanced timer
- General-purpose inputs/outputs
- Quadrature decoder
- Up to 32 fast I/Os
- 28 of them with wake-up capability
- 31 of them 5 V tolerant
- Analog peripherals
- 12-bit ADC with eight input channels, up to 16 bits with a decimation filter
- Battery monitoring
- Analog watchdog
- Analog mic I/F with PGA
- Debug
- Development support
- Serial wire debug (SWD)
- Four breakpoints and two watchpoints
- All packages are ECOPACK2 compliant.
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12.28 M
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