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Octavo Systems LLC OSD32MP157C-512M-BAA
Manufacturer No:
OSD32MP157C-512M-BAA
Manufacturer:
Package:
Description:
MPU Core Arm® Dual Cortex®-A7, Arm® Cortex®-M4 0.709 x 0.709 18mmx18mm 0°C~85°C 302-BGA OSD32MP15x 650MHz, 209MHz
Quantity:
User Guide
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
OSD32MP157C-512M-BAA Information
Octavo Systems LLC OSD32MP157C-512M-BAA technical specifications, attributes, parameters and parts with similar specifications to Octavo Systems LLC OSD32MP157C-512M-BAA.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Operating Temperature
- 0°C~85°C
- Series
- OSD32MP15x
- Size / Dimension
- 0.709 x 0.709 18mmx18mm
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Connector Type
- 302-BGA
- Speed
- 650MHz, 209MHz
- Core Processor
- Arm® Dual Cortex®-A7, Arm® Cortex®-M4
- Module/Board Type
- MPU Core
- Type
- Parameter
- Co-Processor
- NEON? SIMD
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for Octavo Systems LLC OSD32MP157C-512M-BAA.
OSD32MP157C-512M-BAA Description
The OSD32MP157C-512M-BAA System-in-Package (SiP) device delivers all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP157C-512M-BAA has the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4. Along with the processor, the OSD32MP157C-512M-BAA integrates up to 1GB of DDR3L, STPMIC1 Power Management IC, EEPROM, MEMsOscillator, and passives into a single easy-to-use BGA package.
OSD32MP157C-512M-BAA Features
ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillatorandpassive components integrated into a single package
Arm®Cortex®-A7up to 800MHzx2
Arm® Cortex®-M4 up to 209MHz
NEON?SIMD Coprocessor x2
Arm® TrustZone®
USB 2.0 HS + PHY x2
Ethernet 10/100/1000
CANFD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6,I2S x3, QSPI x2
eMMC/SD/SDIO Ports x3
GPIO x148
24-bit RGB Display, MIPI DSI
Camera Interface
22 Channel 16-bit ADC x2, 12-bit DAC x2
OSD32MP157C-512M-BAA Applications
Microwave ovens
Traffic lights
OSD32MP157C-512M-BAA Relevant information
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