LATTICE LC4256V-75FTN256BC
LATTICE LC4256V-75FTN256BC

LATTICE LC4256V-75FTN256BC

Manufacturer No:

LC4256V-75FTN256BC

Manufacturer:

LATTICE

Package:

FTBGA-256

Description:

EE PLD, 7.5ns, 256-Cell, CMOS, PBGA256, FTBGA-256

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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LC4256V-75FTN256BC information

LATTICE LC4256V-75FTN256BC technical specifications, attributes, parameters and parts with similar specifications to LATTICE LC4256V-75FTN256BC.

  • Type
  • Parameter
  • Pbfree Code
  • Yes
  • RoHS Status
  • RoHS Compliant
  • Part Life Cycle Code
  • Active
  • Ihs Manufacturer
  • LATTICE SEMICONDUCTOR CORP
  • Part Package Code
  • BGA
  • Package Description
  • FTBGA-256
  • Pin Count
  • 256
  • Reach Compliance Code
  • compliant
  • ECCN Code
  • EAR99
  • HTS Code
  • 8542.39.00.01
  • Samacsys Manufacturer
  • Lattice Semiconductor
  • Architecture
  • PAD-TYPE
  • Clock Frequency-Max
  • 111 MHz
  • In-System Programmable
  • YES
  • JESD-30 Code
  • S-PBGA-B256
  • JESD-609 Code
  • e1
  • JTAG BST
  • YES
  • Length
  • 17 mm
  • Moisture Sensitivity Level
  • 3
  • Number of Dedicated Inputs
  • 4
  • Number of I/O Lines
  • 160
  • Number of Inputs
  • 164
  • Number of Macro Cells
  • 256
  • Number of Outputs
  • 160
  • Number of Terminals
  • 256
  • Operating Temperature-Max
  • 90 °C
  • Organization
  • 4 DEDICATED INPUTS, 160 I/O
  • Output Function
  • MACROCELL
  • Package Body Material
  • PLASTIC/EPOXY
  • Package Code
  • LBGA
  • Package Equivalence Code
  • BGA256,16X16,40
  • Package Shape
  • SQUARE
  • Package Style
  • GRID ARRAY, LOW PROFILE
  • Peak Reflow Temperature (Cel)
  • 260
  • Programmable Logic Type
  • EE PLD
  • Propagation Delay
  • 7.5 ns
  • Qualification Status
  • Not Qualified
  • Seated Height-Max
  • 1.55 mm
  • Supply Voltage-Max
  • 3.6 V
  • Supply Voltage-Min
  • 3 V
  • Supply Voltage-Nom
  • 3.3 V
  • Surface Mount
  • YES
  • Terminal Finish
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Terminal Form
  • BALL
  • Terminal Pitch
  • 1 mm
  • Terminal Position
  • BOTTOM
  • Time@Peak Reflow Temperature-Max (s)
  • 40

Download datasheets and manufacturer documentation for LATTICE LC4256V-75FTN256BC.

LC4256V-75FTN256BC Overview


There are 256 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).It is embedded in the 256-LBGA package.It is programmed with 160 I/Os.There are 256 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.It is powered from a supply voltage of 3.3V.This part is included in Programmable Logic Devices.It is packaged in the way of Tray.It operates with the operating temperature of 0°C~90°C TJ to ensure its reliability.It is mounted in the way of Surface Mount.It is a type of FPGA belonging to the ispMACH® 4000V series.It is equipped with 256 pin count.It is also characterized by YES.According to the LC4256, its related parts can be found.The supply voltage should be maintained at 3.3V for high efficiency.EEPROM is adopted for storing data.This electronic part is mounted in the way of Surface Mount.It operates with the maximal supply voltage of 3.6V.It operates with the minimal supply voltage of 3V.There are 16 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.The frequency that can be achieved is 178.57MHz.There are 4 dedicated inputs used to detect the status of input signals.There are 36 logic elements/cells to form a fundamental building block.

LC4256V-75FTN256BC Features


256-LBGA package
160 I/Os
The operating temperature of 0°C~90°C TJ
256 pin count


LC4256V-75FTN256BC Applications


There are a lot of Lattice Semiconductor Corporation
LC4256V-75FTN256BC CPLDs applications.


  • Power up sequencing
  • Voltage level translation
  • Timing control
  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems

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