

Renesas IDT71V3577S80PF
Manufacturer No:
IDT71V3577S80PF
Manufacturer:
Package:
TQFP
Description:
Surface Mount 100 Pin Memory IC 4.5 Mb kb 20mm mm 200mA mA 36b b
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IDT71V3577S80PF information
Renesas IDT71V3577S80PF technical specifications, attributes, parameters and parts with similar specifications to Renesas IDT71V3577S80PF.
- Type
- Parameter
- Mount
- Surface Mount
- Package / Case
- TQFP
- Number of Pins
- 100
- Published
- 2005
- JESD-609 Code
- e0
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 100
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Additional Feature
- FLOW-THROUGH ARCHITECTURE
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 240
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 0.65mm
- Reach Compliance Code
- not_compliant
- Frequency
- 100MHz
- Time@Peak Reflow Temperature-Max (s)
- 20
- Pin Count
- 100
- Qualification Status
- Not Qualified
- Operating Supply Voltage
- 3.3V
- Interface
- Parallel
- Max Supply Voltage
- 3.465V
- Min Supply Voltage
- 3.135V
- Number of Ports
- 1
- Nominal Supply Current
- 200mA
- Memory Type
- RAM, SRAM
- Access Time
- 8 ns
- Output Characteristics
- 3-STATE
- Memory Width
- 36
- Address Bus Width
- 17b
- Density
- 4.5 Mb
- Standby Current-Max
- 0.03A
- I/O Type
- COMMON
- Sync/Async
- Synchronous
- Word Size
- 36b
- Length
- 20mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for Renesas IDT71V3577S80PF.
IDT71V3577S80PF Overview
As far as its memory type goes, it falls into the RAM, SRAM category. TQFP case encloses it. There are 100 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 3.3V volt power supply in order to operate properly. In this ic memory chip, there is an 100-pin package that encloses the device. It is worth noting that this memory device has 100 pins, which indicates it has 100 memory locations. This memory chip has an operating supply voltage of 3.3V. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. As far as the nominal supply current of this memory component is concerned, it is rated at 200mA. Despite all its benefits, this memory chip also offers FLOW-THROUGH ARCHITECTURE for improved system performance. Using 1 ports, a single memory address can be read and/or written. A memory map of COMMON bits has been added to the I/O port addresses of this device. Memory ics must operate at a temperature of at least 0°C. Temperatures over 70°C°C are not recommended. There is a common misconception that this component is a type of SRAMs. If this part is to be used, the minimum supply voltage should not be less than 3.135V volts. The operating voltage of the memory ics shall not exceed 3.465V. There is an 100MHz frequency with which this memory chip processes data.
IDT71V3577S80PF Features
Package / Case: TQFP
100 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON
Freguency at 100MHz
100MHz terminals
IDT71V3577S80PF Applications
There are a lot of Integrated Device Technology (IDT)
IDT71V3577S80PF Memory applications.
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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