Renesas HI5860IBZ
Manufacturer No:
HI5860IBZ
Manufacturer:
Renesas
Package:
SOIC
Description:
DAC 1.5 B B 7.5mm mm
Quantity:
In Stock :2260
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
HI5860IBZ Information
Renesas HI5860IBZ technical specifications, attributes, parameters and parts with similar specifications to Renesas HI5860IBZ.
- Type
- Parameter
- Factory Lead Time
- 7 Weeks
- Mount
- Surface Mount
- Package / Case
- SOIC
- Number of Pins
- 28
- Packaging
- Bulk
- Published
- 1999
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 28
- Type
- Parameter
- Terminal Finish
- Matte Tin (Sn) - annealed
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- -40°C
- Subcategory
- Other Converters
- Technology
- CMOS
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
- Number of Functions
- 1
- Supply Voltage
- 5V
Download datasheets and manufacturer documentation for Renesas HI5860IBZ.
Datasheets:
HI5860IBZ Overview
There is a SOIC package that includes this component. It is powered from a supply voltage of 5V. Other Converters family FPGA part. As a space-saving measure, this FPGA model is contained within Bulk. Total terminations are 28. It has a total of 28 pins that are designed for it. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. This module is capable of operating at a maximum temperature of 85°C. -40°C should be higher than the operating temperature. As far as the pin count is concerned, it has 28 pins. The maximum supply voltage it supports is 5V. With a minimum supply voltage of 2.7V, it is able to function.
HI5860IBZ Features
SOIC package
28 pin count
28 pins
HI5860IBZ Applications
There are a lot of Intersil (Renesas Electronics America)
HI5860IBZ Digital to Analog Converters (DAC) applications.
- Display Electronics
- Data Acquisition Systems
- Calibration
- Motor Control
- Data Distribution System
- Digital Potentiometer
- Software Radio
- Wireless infrastructure:
- WCDMA, CDMA2000, TD-SCDMA, WiMAX
- Wideband communications:
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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