ONSEMI FDZ371PZ
Manufacturer No:
FDZ371PZ
Manufacturer:
ONSEMI
Package:
4-XFBGA, WLCSP
Description:
P-Channel 1.5 V Specified PowerTrench<sup>®</sup> Thin WL-CSP MOSFET -20V, -3.7A, 75mΩ
Quantity:
In Stock :6423
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Mon, Jun 1 - Tue, Jun 2, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
Payment
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Authenticity Guarantee
All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.
Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Aichiplink operates certified in-house inspection and testing facilities to ensure all electronic components meet internationally recognized quality and compliance standards. Our quality management system is verified through ISO 9001 certification and industry-standard inspection procedures.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
FDZ371PZ Information
ONSEMI FDZ371PZ technical specifications, attributes, parameters and parts with similar specifications to ONSEMI FDZ371PZ.
- Type
- Parameter
- Qg Typ @ VGS = 4.5 V (nC)
- 9
- Ciss Typ (pF)
- 750
- Qgd Typ @ VGS = 4.5 V (nC)
- -
- Channel Polarity
- P-Channel
- PD Max (W)
- 1.7
- Container Type
- REEL
- RDS(on) Max @ VGS = 10 V (mΩ)
- -
- ID Max (A)
- -3.7
- Qg Typ @ VGS = 10 V (nC)
- 12
- Coss Typ (pF)
- -
- Type
- Parameter
- Case Outline
- 567PS
- Vgs(th) Max (V)
- -1
- V(BR)DSS Min (V)
- -20
- Crss Typ (pF)
- -
- Silicon Family
- NA
- Container Qty.
- 5000
- Wide SOA Mosfets
- 0
- OPN in older Technology
- 0
- RDS(on) Max @ VGS = 2.5 V (mΩ)
- 90
- Package Type
- WLCSP-4
Download datasheets and manufacturer documentation for ONSEMI FDZ371PZ.
Datasheet:
Package Drawing:
Designed on an advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ371PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Application
- This product is general usage and suitable for many different applications.
- Battery Management
- Load Switch
- Battery Protection
Feature
- Max rDS(on) = 75 mΩ at VGS = -4.5 V, ID = -2.0 A
- Max rDS(on) = 90 mΩ at VGS = -2.5 V, ID = -1.5 A
- Max rDS(on) = 110 mΩ at VGS = -1.8 V, ID = -1.0 A
- Max rDS(on) = 150 mΩ at VGS = -1.5 V, ID = -1.0 A
- Occupies only 1.0 mm2 of PCB area. Less than 30% of the area of 2 x 2 BGA
- Ultra-thin package: less than 0.4 mm height when mounted to PCB
- HBM ESD protection level > 4.4 kV (Note 3)
- RoHS Compliant
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
