Lattice Semiconductor

Intel

Xilinx

Microchip Technology

Atmel (Microchip Technology)

Cypress Semiconductor

Rochester Electronics

Dialog Semiconductor

Broadcom

E2V

Adesto Technologies

AMD

e0

e3

e1

e4

e3/e4

e6

e2

3 (168 Hours)

1 (Unlimited)

2 (1 Year)

4 (72 Hours)

5 (48 Hours)

6 (Time on Label)

Surface Mount

Through Hole

32

64

128

36

96

192

160

10

68

34

84

120

80

8

164

30

212

48

100

81

69

52

24

208

133

72

116

37

117

256

76

92

108

141

104

74

118

144

33

124

79

136

193

168

165

173

204

272

172

54

12

40

16

176

271

317

38

166

180

304

114

132

159

294

149

197

220

260

125

211

66

17

253

184

191

288

381

106

153

158

196

203

240

270

384

45

60

98

11

368

41

113

13

139

175

28

161

21

216

428

64

128

256

32

512

384

192

10

72

24

36

440

8

288

96

144

320

108

980

1700

160

768

1024

216

12

1536

560

3072

19

400

480

7

1140

2

1

26

600

16

17

9

100

44

256

208

144

48

160

84

176

128

28

20

24

64

324

68

56

132

352

388

272

484

280

40

32

169

240

676

14

192

120

22

49

672

12

320

356

69

8

0°C~70°C TA

-40°C~85°C TA

0°C~90°C TJ

-40°C~105°C TJ

0°C~85°C TJ

0°C~75°C TA

-40°C~100°C TJ

-40°C~130°C TJ

-40°C~125°C TA

-40°C~125°C TJ

-40°C~105°C TA

-40°C~85°C

-55°C~125°C TA

-55°C~125°C TC

MACROCELL

COMBINATORIAL

MIXED

44-TQFP

100-LQFP

44-LCC (J-Lead)

208-BFQFP

256-BGA

144-LQFP

256-LBGA

100-TQFP

48-LQFP

160-BQFP

100-BQFP

84-LCC (J-Lead)

176-LQFP

128-LQFP

28-LCC (J-Lead)

PQFP

J

TQFP

FBGA

PLCC

24-DIP (0.300, 7.62mm)

100-LBGA

208-BFQFP Exposed Pad

48-FBGA, CSPBGA

56-LFBGA, CSPBGA

20-LCC (J-Lead)

484-BBGA

160-LQFP

388-BBGA

144-TFBGA, CSPBGA

128-BQFP

A

272-BBGA

20-DIP (0.300, 7.62mm)

TFBGA

100-TFBGA

68-LCC (J-Lead)

132-LFBGA, CSPBGA

44-LQFP

64-TQFP

352-LBGA

324-BBGA

324-BGA

LCC

169-LFBGA

100-LFBGA

132-TFBGA, CSPBGA

240-BFQFP Exposed Pad

280-TFBGA, CSPBGA

208-BGA

24-SOIC (0.295, 7.50mm Width)

256-TFBGA

32-VFQFN Exposed Pad

64-TQFP Exposed Pad

49-LFBGA

68-TFBGA

PDIP

144-BGA

20-UFQFN

352-LBGA Exposed Pad, Metal

256-BBGA

44-CLCC, Window (J-Lead)

64-TFBGA, CSPBGA

BGA

DIP

14-UFQFN

292-BGA

324-LBGA

40-DIP (0.600, 15.24mm)

CDIP

S

672-BBGA

64-TFBGA

676-BBGA

160-BPGA

192-BPGA

40-CDIP (0.600, 15.24mm) Window

64-VFBGA, CSPBGA

CLCC

LQFP

28-SSOP (0.209, 5.30mm Width)

48-TQFP

FCBGA

12-UFQFN

120-BQFP

132-VFBGA

144-TFBGA

20-TSSOP (0.173, 4.40mm Width)

22-UFQFN

48-VFQFN Exposed Pad

Q

24-CDIP (0.300, 7.62mm)

24-TSSOP (0.173, 4.40mm Width)

28-CLCC

304-BFQFP

12-WFDFN Exposed Pad

16-UFQFN Exposed Pad

356-LBGA

40-CDIP (0.600, 15.24mm)

44-CLCC (J-Lead)

Tray

Tube

Bulk

Tape & Reel (TR)

Tape and Reel

Tape & Reel

Obsolete

Active

Not For New Designs

Discontinued

Unconfirmed

In System Programmable

In System Programmable (min 10K program/erase cycles)

EE PLD

In System Programmable (min 1K program/erase cycles)

In-System Reprogrammable™ (ISR™) CMOS

OTP

In System Programmable (min 100 program/erase cycles)

UV Erasable

In-System Reprogrammable™ (ISR™) Flash