TI XOMAPL137DZKBA3
Manufacturer No:
XOMAPL137DZKBA3
Manufacturer:
Package:
256-BGA
Description:
1mm ARM926EJ-S Microprocessor OMAP-L1x Series OMAPL137 1.2V 256-BGA
Quantity:
User Guide
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XOMAPL137DZKBA3 Information
TI XOMAPL137DZKBA3 technical specifications, attributes, parameters and parts with similar specifications to TI XOMAPL137DZKBA3.
- Type
- Parameter
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~105°C TJ
- Packaging
- Tray
- Series
- OMAP-L1x
- JESD-609 Code
- e1
- Pbfree Code
- no
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 256
- Type
- Parameter
- ECCN Code
- 3A991.A.2
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.31.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 1.2V
- Terminal Pitch
- 1mm
- Base Part Number
- OMAPL137
Download datasheets and manufacturer documentation for TI XOMAPL137DZKBA3.
Datasheets:
PCN Design/Specification:
XOMAPL137DZKBA3 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~105°C TJ. The cpu microprocessor belongs to the OMAP-L1x series. The CPU is cored with a ARM926EJ-S processor. The CPU uses SDRAM RAM controllers. This microprocessor features interfaces HPI, I2C, McASP, MMC/SD, SPI, UART. In this CPU, I/O is set to 1.8V 3.3V. In terms of uPs and uCs as well as peripheral ICs, this is a DIGITAL SIGNAL PROCESSOR, OTHER. The microprocessor can be searched for with OMAPL137 if you are looking for variants. In total, there are 256 terminations. When the voltage supply is 1.2V, the cpu microprocessor should be powered on and run. It can supply a maximum current of 1.32V. 16 is the width of the external data bus on this CPU. Embedded microprocessor bodies are injected with 256 pins. 30MHz is the microprocessor's clock frequency.
XOMAPL137DZKBA3 Features
ARM926EJ-S Core
XOMAPL137DZKBA3 Applications
There are a lot of Texas Instruments
XOMAPL137DZKBA3 Microprocessor applications.
- Consumer electronics products
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
XOMAPL137DZKBA3 Relevant information
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