AMD XCZU9EG-L1FFVC900I
Manufacturer No:
XCZU9EG-L1FFVC900I
Manufacturer:
AMD
Package:
900-BBGA, FCBGA
Description:
900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 204 I/O 0.72V
Quantity:
In Stock :3168
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 28 - Mon, Jun 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU9EG-L1FFVC900I Information
AMD XCZU9EG-L1FFVC900I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU9EG-L1FFVC900I.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 900-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Published
- 2013
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 900
- Type
- Parameter
- Additional Feature
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- HTS Code
- 8542.31.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 0.72V
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- R-PBGA-B900
- Supply Voltage-Max (Vsup)
- 0.742V
Download datasheets and manufacturer documentation for AMD XCZU9EG-L1FFVC900I.
Datasheets:
Environmental Information:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+? MPSoC EG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+? FPGA, 599K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU9EG-L1FFVC900I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
XCZU9EG-L1FFVC900I FAQ
Can I request a quote for XCZU9EG-L1FFVC900I?
XCZU9EG-L1FFVC900I from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for XCZU9EG-L1FFVC900I?
The final price for XCZU9EG-L1FFVC900I depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for XCZU9EG-L1FFVC900I?
XCZU9EG-L1FFVC900I is a AMD electronic component part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED and Moisture Sensitivity Level (MSL): 4 (72 Hours); contact us if you need the specifications verified before sourcing.
When will I receive a quotation for XCZU9EG-L1FFVC900I?
After you submit the RFQ for XCZU9EG-L1FFVC900I, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for XCZU9EG-L1FFVC900I?
Once stock for XCZU9EG-L1FFVC900I is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to XCZU9EG-L1FFVC900I?
Yes. If XCZU9EG-L1FFVC900I is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.
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