XCZU7CG-2FBVB900I-AMD-Price, Stock & Datasheet

This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+? MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+? FPGA, 504K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 204 I/Os.Use a power supply with a voltage of 0.85V if possible.It is unsafe to operate the SoCs wireless at voltages above 0.876V.Power supplies of at least 0.825V are required.A system on a chip benefits from having 900 terminations.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.

XCZU7CG-2FBVB900I System On Chip (SoC) applications.

Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances

AMD XCZU7CG-2FBVB900I

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