AMD XCZU6EG-1FFVC900E
Manufacturer No:
XCZU6EG-1FFVC900E
Manufacturer:
AMD
Package:
900-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 204 I/O
Quantity:
In Stock :6117
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Tue, Jun 9 - Wed, Jun 10, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
Payment
We support multiple secure payment methods including PayPal, Visa, MasterCard, and American Express. All transactions are protected with advanced encryption to ensure secure and reliable payments.
Authenticity Guarantee
All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.
Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU6EG-1FFVC900E Information
AMD XCZU6EG-1FFVC900E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU6EG-1FFVC900E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 900-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Published
- 2016
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Type
- Parameter
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 204
- Speed
- 500MHz, 600MHz, 1.2GHz
- RAM Size
- 256KB
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 469K+ Logic Cells
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCZU6EG-1FFVC900E.
Datasheets:
Environmental Information:
XCZU6EG-1FFVC900E Description
XCZU6EG-1FFVC900E core processor(s) are used in the construction of this SoC.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer. As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users. In terms of internal architecture, this SoC design uses the MCU, FPGA method. In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included. It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells and that is something to note. It comes in a state-of-the-art Tray package. This SoC part has a total of 204 I/Os.
XCZU6EG-1FFVC900E Features
Reliable performance
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-1FFVC900E System On Chip (SoC) applications.
Medical
PC peripherals
Cyberphysical system-on-chip
High-end PLC
AC drive control module
Fitness
Sports
Industrial automation devices
ARM Cortex M4 microcontroller
Sensor network-on-chip (sNoC)
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡).png&w=256&q=75)
