AMD XCZU6CG-2FFVB1156E
Manufacturer No:
XCZU6CG-2FFVB1156E
Manufacturer:
AMD
Package:
1156-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 328 I/O
Quantity:
In Stock :9247
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU6CG-2FFVB1156E Information
AMD XCZU6CG-2FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU6CG-2FFVB1156E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 1156-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Bulk
- Series
- Zynq® UltraScale+? MPSoC CG
- Published
- 2016
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 328
- Speed
- 533MHz, 1.3GHz
- RAM Size
- 256KB
- Core Processor
- Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 469K+ Logic Cells
Download datasheets and manufacturer documentation for AMD XCZU6CG-2FFVB1156E.
Datasheets:
Environmental Information:
This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+? MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+? FPGA, 469K+ Logic Cells together.Bulk package houses this SoC system on a chip.An integral part of this SoC consists of a total of 328 I/Os.
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6CG-2FFVB1156E System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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