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AMD XCZU5EG-2FBVB900E
Manufacturer No:
XCZU5EG-2FBVB900E
Manufacturer:
AMD
Package:
900-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 204 I/O
Quantity:
In Stock :6007
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Fri, Jun 12 - Sat, Jun 13, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU5EG-2FBVB900E Information
AMD XCZU5EG-2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU5EG-2FBVB900E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 900-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Published
- 2016
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 204
- Speed
- 533MHz, 600MHz, 1.3GHz
- RAM Size
- 256KB
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 256K+ Logic Cells
Download datasheets and manufacturer documentation for AMD XCZU5EG-2FBVB900E.
Datasheets:
Environmental Information:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
On this SoC, there is Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+? MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+? FPGA, 256K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 204 I/Os.
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-2FBVB900E System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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