AMD XCZU4CG-L2FBVB900E

Manufacturer No:

XCZU4CG-L2FBVB900E

Manufacturer:

AMD

Package:

900-BBGA, FCBGA

Description:

900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 204 I/O 0.72V

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU4CG-L2FBVB900E information

AMD XCZU4CG-L2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU4CG-L2FBVB900E.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
900-BBGA, FCBGA

Surface Mount
YES

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC CG

Published
2016

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
900

Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

HTS Code
8542.31.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
0.72V

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
R-PBGA-B900

Supply Voltage-Max (Vsup)
0.742V

Supply Voltage-Min (Vsup)
0.698V

Number of I/O
204

Speed
500MHz, 1.2GHz

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 192K+ Logic Cells

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU4CG-L2FBVB900E.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+? MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+? FPGA, 192K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 204 inputs and outputs.Ideally, a power supply with a voltage of 0.72V should be used.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.698V, it should be able to function.system on a chip benefits from 900 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.

XCZU4CG-L2FBVB900E System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

User Guide

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