AMD XCZU4CG-L1FBVB900I

Manufacturer No:

XCZU4CG-L1FBVB900I

Manufacturer:

AMD

Package:

900-BBGA, FCBGA

Description:

900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 204 I/O 0.72V

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU4CG-L1FBVB900I information

AMD XCZU4CG-L1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU4CG-L1FBVB900I.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
900-BBGA, FCBGA

Surface Mount
YES

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC CG

Published
2016

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
900

Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

HTS Code
8542.31.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
0.72V

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
R-PBGA-B900

Supply Voltage-Max (Vsup)
0.742V

Supply Voltage-Min (Vsup)
0.698V

Number of I/O
204

Speed
500MHz, 1.2GHz

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 192K+ Logic Cells

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU4CG-L1FBVB900I.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+? MPSoC CG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+? FPGA, 192K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.

XCZU4CG-L1FBVB900I System On Chip (SoC) applications.

Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics

User Guide

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