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AMD XCZU4CG-1FBVB900E
Manufacturer No:
XCZU4CG-1FBVB900E
Manufacturer:
AMD
Package:
900-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 204 I/O
Quantity:
In Stock :5069
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
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Shipped from：HK Warehouse
Expected Shipping：Sat, Jun 13 - Sun, Jun 14, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
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Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU4CG-1FBVB900E Information
AMD XCZU4CG-1FBVB900E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU4CG-1FBVB900E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 900-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC CG
- Published
- 2016
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Type
- Parameter
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 204
- Speed
- 500MHz, 1.2GHz
- RAM Size
- 256KB
- Core Processor
- Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 192K+ Logic Cells
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCZU4CG-1FBVB900E.
Datasheets:
Environmental Information:
This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+? MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+? FPGA, 192K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4CG-1FBVB900E System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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