AMD XCZU2EG-2SFVC784I
AMD XCZU2EG-2SFVC784I

AMD XCZU2EG-2SFVC784I

Manufacturer No:

XCZU2EG-2SFVC784I

Manufacturer:

AMD

Package:

784-BFBGA, FCBGA

Description:

784 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 252 I/O 0.85V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XCZU2EG-2SFVC784I information

AMD XCZU2EG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU2EG-2SFVC784I.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 784-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq® UltraScale+? MPSoC EG
  • Published
  • 2013
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 784
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.85V
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • R-PBGA-B784
  • Supply Voltage-Max (Vsup)
  • 0.876V
  • Supply Voltage-Min (Vsup)
  • 0.825V
  • Number of I/O
  • 252
  • Speed
  • 533MHz, 600MHz, 1.3GHz
  • RAM Size
  • 256KB
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR CIRCUIT
  • Peripherals
  • DMA, WDT
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Primary Attributes
  • Zynq®UltraScale+? FPGA, 103K+ Logic Cells
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU2EG-2SFVC784I.

Datasheets:

Environmental Information:

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+? FPGA, 103K+ Logic Cells.Housed in the state-of-art Tray package.252 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.For the SoCs wireless, a voltage higher than 0.876V is considered unsafe.It can feed on a power supply of at least 0.825V.There are 784 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2EG-2SFVC784I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

User Guide

PURCHASE

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MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

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