AMD XCZU2EG-2SFVA625E
Manufacturer No:
XCZU2EG-2SFVA625E
Manufacturer:
AMD
Package:
625-BFBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 180 I/O
Quantity:
In Stock :3167
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU2EG-2SFVA625E Information
AMD XCZU2EG-2SFVA625E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU2EG-2SFVA625E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 625-BFBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Published
- 2013
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 180
- Speed
- 533MHz, 600MHz, 1.3GHz
- RAM Size
- 256KB
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 103K+ Logic Cells
Download datasheets and manufacturer documentation for AMD XCZU2EG-2SFVA625E.
Datasheets:
Environmental Information:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.This system on a chip is packaged as 625-BFBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+? MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+? FPGA, 103K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 180 I/Os.
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2EG-2SFVA625E System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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