AMD XCZU2CG-2SFVA625I
AMD XCZU2CG-2SFVA625I

AMD XCZU2CG-2SFVA625I

Manufacturer No:

XCZU2CG-2SFVA625I

Manufacturer:

AMD

Package:

625-BFBGA, FCBGA

Description:

625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 180 I/O 0.85V

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

XCZU2CG-2SFVA625I Information

AMD XCZU2CG-2SFVA625I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU2CG-2SFVA625I.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 625-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq® UltraScale+? MPSoC CG
  • Published
  • 2016
  • JESD-609 Code
  • e1
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Type
  • Parameter
  • Number of Terminations
  • 625
  • Terminal Finish
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.85V
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • R-PBGA-B625

Download datasheets and manufacturer documentation for AMD XCZU2CG-2SFVA625I.

This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).


On this SoC, there is Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor.Assigned with the package 625-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+? MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+? FPGA, 103K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 180 I/Os.It is recommended to use a 0.85V power supply.In the SoCs wireless, voltages above 0.876V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.825V.In total, there are 625 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2CG-2SFVA625I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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Shipped from:HK Warehouse
Expected Shipping:Wed, Mar 25 - Thu, Mar 26, 2026
Date Code:Within 2 Years

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