AMD XCZU19EG-L1FFVC1760I

Manufacturer No:

XCZU19EG-L1FFVC1760I

Manufacturer:

AMD

Package:

1760-BBGA, FCBGA

Description:

-40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 512 I/O 0.72V

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU19EG-L1FFVC1760I information

AMD XCZU19EG-L1FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU19EG-L1FFVC1760I.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
1760-BBGA, FCBGA

Surface Mount
YES

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC EG

Published
2016

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

HTS Code
8542.31.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
0.72V

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
R-PBGA-B1760

Supply Voltage-Max (Vsup)
0.742V

Supply Voltage-Min (Vsup)
0.698V

Number of I/O
512

Speed
500MHz, 600MHz, 1.2GHz

RAM Size
256KB

uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 1143K+ Logic Cells

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU19EG-L1FFVC1760I.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 1760-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+? MPSoC EG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+? FPGA, 1143K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.512 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.

XCZU19EG-L1FFVC1760I System On Chip (SoC) applications.

Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics

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