AMD XCZU19EG-2FFVC1760I

Manufacturer No:

XCZU19EG-2FFVC1760I

Manufacturer:

AMD

Package:

1760-BBGA, FCBGA

Description:

-40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 512 I/O

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU19EG-2FFVC1760I information

AMD XCZU19EG-2FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU19EG-2FFVC1760I.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
1760-BBGA, FCBGA

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC EG

Published
2016

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

HTS Code
8542.31.00.01

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Number of I/O
512

Speed
533MHz, 600MHz, 1.3GHz

RAM Size
256KB

Core Processor
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 1143K+ Logic Cells

RoHS Status
ROHS3 Compliant

Download datasheets and manufacturer documentation for AMD XCZU19EG-2FFVC1760I.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+? MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+? FPGA, 1143K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 512 I/Os.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU19EG-2FFVC1760I System On Chip (SoC) applications.

Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical

User Guide

PURCHASE

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IMPORTANT NOTICE

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SHIPPING COST

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SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.