AMD XCZU15EG-1FFVB1156I

Manufacturer No:

XCZU15EG-1FFVB1156I

Manufacturer:

AMD

Package:

1156-BBGA, FCBGA

Description:

-40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 328 I/O

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU15EG-1FFVB1156I information

AMD XCZU15EG-1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU15EG-1FFVB1156I.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
1156-BBGA, FCBGA

Operating Temperature
-40°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC EG

Published
2016

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

HTS Code
8542.31.00.01

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Number of I/O
328

Speed
500MHz, 600MHz, 1.2GHz

RAM Size
256KB

Core Processor
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 747K+ Logic Cells

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU15EG-1FFVB1156I.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+? MPSoC EG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+? FPGA, 747K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.328 I/Os are included in this SoC part.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU15EG-1FFVB1156I System On Chip (SoC) applications.

Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics

User Guide

PURCHASE

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MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.