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AMD XCVU35P-3FSVH2104E
Manufacturer No:
XCVU35P-3FSVH2104E
Manufacturer:
AMD
Package:
2104-BBGA, FCBGA
Description:
FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA
Quantity:
In Stock :4943
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Expected Shipping：Mon, Jun 15 - Tue, Jun 16, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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XCVU35P-3FSVH2104E Information
AMD XCVU35P-3FSVH2104E technical specifications, attributes, parameters and parts with similar specifications to AMD XCVU35P-3FSVH2104E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 2104-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Series
- Virtex® UltraScale+™
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Voltage - Supply
- 0.873V~0.927V
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 416
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 1906800
- Total RAM Bits
- 49597645
- Number of LABs/CLBs
- 108960
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCVU35P-3FSVH2104E.
Datasheets:
Environmental Information:
XCVU35P-3FSVH2104E Overview
In the package 2104-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 416 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 1906800 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. This is a type of FPGA that is part of the Virtex® UltraScale+™ series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga electronics is worth mentioning that this device provides 49597645 bfpga electronics s of RAM. The FPGA is built as an array of 108960 latches or CLBs.
XCVU35P-3FSVH2104E Features
416 I/Os
Up to 49597645 RAM bits
XCVU35P-3FSVH2104E Applications
There are a lot of Xilinx Inc.
XCVU35P-3FSVH2104E FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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12.28 M
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