AMD XCVU190-3FLGB2104E
Manufacturer No:
XCVU190-3FLGB2104E
Manufacturer:
AMD
Package:
2104-BBGA, FCBGA
Description:
FPGAs Virtex® UltraScale™ Series 2104-BBGA, FCBGA
Quantity:
In Stock :9260
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Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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XCVU190-3FLGB2104E Information
AMD XCVU190-3FLGB2104E technical specifications, attributes, parameters and parts with similar specifications to AMD XCVU190-3FLGB2104E.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 2104-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Virtex® UltraScale™
- Published
- 2013
- JESD-609 Code
- e1
- Part Status
- Active
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- ECCN Code
- 3A001.A.7.B
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.39.00.01
- Voltage - Supply
- 0.970V~1.030V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 1V
- Reach Compliance Code
- not_compliant
Download datasheets and manufacturer documentation for AMD XCVU190-3FLGB2104E.
Datasheets:
Environmental Information:
XCVU190-3FLGB2104E Overview
In the 2104-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 702 I/O ports for more coherent data transfer. To form a fundamental building block, there are 2349900 logic elements/cells. In order to operate fpga chips, a voltage supply of 1V volts is required. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.970V~1.030V-volt supply voltage required for the device to operate. The Virtex® UltraScale™ Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 150937600 bFpga chipss. It is crucial that the RAM si16.6MBe of this FPGA module reaches 16.6MB so that the program can run normally. A total of 134280 LABs/CLBs are included in this FPGA. For its architecture, 1800 CLB modules are used.
XCVU190-3FLGB2104E Features
702 I/Os
Up to 150937600 RAM bits
XCVU190-3FLGB2104E Applications
There are a lot of Xilinx Inc.
XCVU190-3FLGB2104E FPGAs applications.
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
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