

AMD XCVU190-2FLGA2577E
Manufacturer No:
XCVU190-2FLGA2577E
Manufacturer:
Package:
2577-BBGA, FCBGA
Description:
950mV V 4.01mm mm FPGAs Virtex® UltraScale? Series 2577-BBGA, FCBGA 1mm mm
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XCVU190-2FLGA2577E information
AMD XCVU190-2FLGA2577E technical specifications, attributes, parameters and parts with similar specifications to AMD XCVU190-2FLGA2577E.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 2577-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Virtex® UltraScale?
- Published
- 2013
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- ECCN Code
- 3A001.A.7.B
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Voltage - Supply
- 0.922V~0.979V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 0.95V
- Terminal Pitch
- 1mm
- Reach Compliance Code
- not_compliant
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Operating Supply Voltage
- 950mV
- Number of I/O
- 448
- Organization
- 1800 CLBS
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 2349900
- Total RAM Bits
- 150937600
- Number of LABs/CLBs
- 134280
- Speed Grade
- 2
- Number of Registers
- 2.14848e+06
- Number of CLBs
- 1800
- Height Seated (Max)
- 4.01mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCVU190-2FLGA2577E.
Datasheets:
Environmental Information:
XCVU190-2FLGA2577E Overview
The package that contains this software is called 2577-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 448 I/Os for better data transfer. In order to construct a fundamental building block, 2349900 logic elements/cells are required. In order for the device to operate, a supply voltage of 0.95V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.922V~0.979V battery. There are many types of FPGAs in the Virtex® UltraScale? series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 150937600. For the program to work properly, the RAM si16.6MBe of this FPGA module must reach 16.6MB GB in order to ensure normal operation. 134280 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 950mV supply voltage. In order to store and transfer data, a total of 2.14848e+06 registers are used. An architecture consists of 1800 CLBs.
XCVU190-2FLGA2577E Features
448 I/Os
Up to 150937600 RAM bits
2.14848e+06 registers
XCVU190-2FLGA2577E Applications
There are a lot of Xilinx Inc.
XCVU190-2FLGA2577E FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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