AMD XCV600-5BG560C

Manufacturer No:

XCV600-5BG560C

Manufacturer:

AMD

Package:

560-LBGA Exposed Pad, Metal

Description:

1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

Quantity:

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XCV600-5BG560C information

AMD XCV600-5BG560C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV600-5BG560C.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
560-LBGA Exposed Pad, Metal

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Virtex®

Published
2000

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
560

ECCN Code
EAR99

Terminal Finish
Tin/Lead (Sn63Pb37)

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Voltage - Supply
2.375V~2.625V

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
2.5V

Terminal Pitch
1.27mm

Reach Compliance Code
not_compliant

Base Part Number
XCV600

Pin Count
560

JESD-30 Code
S-PBGA-B560

Number of Outputs
404

Qualification Status
Not Qualified

Power Supplies
1.2/3.62.5V

Number of I/O
404

RAM Size
12kB

Clock Frequency
294MHz

Number of Inputs
404

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells
15552

Total RAM Bits
98304

Number of Gates
661111

Number of LABs/CLBs
3456

Combinatorial Delay of a CLB-Max
0.7 ns

Length
42.5mm

Height Seated (Max)
1.7mm

Width
42.5mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCV600-5BG560C.

Datasheets:

xilinxinc-xcv1004pq240c-datasheets-8488.pdf

PCN Obsolescence/ EOL:

xilinxinc-xcs053vq100c-pcnobsolescenceeol-8031.pdf

XCV600-5BG560C Overview

The package that contains this software is called 560-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 404 I/Os for better data transfer. In order to construct a fundamental building block, 15552 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 404 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 98304. If you are looking for related parts, you can use the base part number XCV600 as a starting point. For the program to work properly, the RAM si12kBe of this FPGA module must reach 12kB GB in order to ensure normal operation. 3456 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 661111 gates. A total of 560 pins are included in this device. Most of the time, it uses a crystal oscillating at 294MHz to generate the signal.

XCV600-5BG560C Features

404 I/Os
Up to 98304 RAM bits

XCV600-5BG560C Applications

There are a lot of Xilinx Inc.
XCV600-5BG560C FPGAs applications.

Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics

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