AMD XCV400E-6BG560C
AMD XCV400E-6BG560C

AMD XCV400E-6BG560C

Manufacturer No:

XCV400E-6BG560C

Manufacturer:

AMD

Package:

560-LBGA Exposed Pad, Metal

Description:

1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

Delivery:

DHL
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DHL

Payment:

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In Stock :Available

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XCV400E-6BG560C information

AMD XCV400E-6BG560C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV400E-6BG560C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 560-LBGA Exposed Pad, Metal
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®-E
  • Published
  • 2006
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 560
  • ECCN Code
  • 3A991.D
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.71V~1.89V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 1.8V
  • Terminal Pitch
  • 1.27mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XCV400E
  • Number of Outputs
  • 404
  • Operating Supply Voltage
  • 1.8V
  • Number of I/O
  • 404
  • RAM Size
  • 20kB
  • Clock Frequency
  • 357MHz
  • Number of Inputs
  • 404
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 10800
  • Total RAM Bits
  • 163840
  • Number of Gates
  • 569952
  • Number of LABs/CLBs
  • 2400
  • Speed Grade
  • 6
  • Combinatorial Delay of a CLB-Max
  • 0.47 ns
  • Length
  • 42.5mm
  • Height Seated (Max)
  • 1.7mm
  • Width
  • 42.5mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV400E-6BG560C.

XCV400E-6BG560C Overview


There is a 560-LBGA Exposed Pad, Metal package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 404 I/Os are available for transferring data more efficiently. A fundamental building block consists of 10800 logic elements/cells. It is powered from a supply voltage of 1.8V. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.71V~1.89V is needed in order for fpga chips to operate. As part of the Virtex®-E series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. The device has 404 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 560. There are 163840 RAM bits that are available with this device. In order to find related parts, you can use its base part number XCV400E. There is a maximum RAM si20kBe of 20kB on this FPGA module, which is necessary to ensure the normal operation of the program. 2400 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.8V supply voltage. There are 569952 gates that make up its basic building block. As far as the pin count is concerned, it has 560 pins. Usually, fpga semiconductor uses a 357MHz crystal.

XCV400E-6BG560C Features


404 I/Os
Up to 163840 RAM bits


XCV400E-6BG560C Applications


There are a lot of Xilinx Inc.
XCV400E-6BG560C FPGAs applications.


  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding

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