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AMD XCV400-4BG560I
Manufacturer No:
XCV400-4BG560I
Manufacturer:
AMD
Package:
560-LBGA Exposed Pad, Metal
Description:
2.5V V 1.7mm mm FPGAs Virtex® Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
Quantity:
In Stock :3625
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
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Expected Shipping：Mon, Jun 29 - Tue, Jun 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
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Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCV400-4BG560I Information
AMD XCV400-4BG560I technical specifications, attributes, parameters and parts with similar specifications to AMD XCV400-4BG560I.
- Type
- Parameter
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 560-LBGA Exposed Pad, Metal
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Virtex®
- Published
- 2000
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Obsolete
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 560
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Lead (Sn63Pb37)
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 2.375V~2.625V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
Download datasheets and manufacturer documentation for AMD XCV400-4BG560I.
Datasheets:
PCN Obsolescence/ EOL:
XCV400-4BG560I Overview
A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 10800 logic elements/cells. An electrical supply voltage of 2.5V powers it. A Field Programmable Gate Arrays-series FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 2.375V~2.625V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex® series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 81920. Related parts can be found by using its base part number XCV400. The FPGA module's RAM si10kBe reaches 10kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 2400 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 2.5V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 468252 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 250MHz, to create the signal.
XCV400-4BG560I Features
404 I/Os
Up to 81920 RAM bits
XCV400-4BG560I Applications
There are a lot of Xilinx Inc.
XCV400-4BG560I FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
XCV400-4BG560I FAQ
Can I request a quote for XCV400-4BG560I?
XCV400-4BG560I from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for XCV400-4BG560I?
The final price for XCV400-4BG560I depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for XCV400-4BG560I?
XCV400-4BG560I is a AMD electronic component part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 3 (168 Hours); contact us if you need the specifications verified before sourcing.
When will I receive a quotation for XCV400-4BG560I?
After you submit the RFQ for XCV400-4BG560I, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for XCV400-4BG560I?
Once stock for XCV400-4BG560I is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to XCV400-4BG560I?
Yes. If XCV400-4BG560I is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.
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