AMD XCV300E-7FG456C
AMD XCV300E-7FG456C

AMD XCV300E-7FG456C

Manufacturer No:

XCV300E-7FG456C

Manufacturer:

AMD

Package:

456-BBGA

Description:

1.8V V 2.6mm mm FPGAs Virtex®-E Series 456-BBGA 1mm mm 456

Delivery:

DHL
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Payment:

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In Stock :Available

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XCV300E-7FG456C information

AMD XCV300E-7FG456C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV300E-7FG456C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 456-BBGA
  • Number of Pins
  • 456
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®-E
  • Published
  • 2006
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 456
  • ECCN Code
  • 3A991.D
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.71V~1.89V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 1.8V
  • Terminal Pitch
  • 1mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 456
  • Number of Outputs
  • 312
  • Operating Supply Voltage
  • 1.8V
  • Number of I/O
  • 312
  • RAM Size
  • 16kB
  • Clock Frequency
  • 400MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 6912
  • Total RAM Bits
  • 131072
  • Number of Gates
  • 411955
  • Number of LABs/CLBs
  • 1536
  • Speed Grade
  • 7
  • Combinatorial Delay of a CLB-Max
  • 0.42 ns
  • Number of Equivalent Gates
  • 82944
  • Length
  • 23mm
  • Height Seated (Max)
  • 2.6mm
  • Width
  • 23mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV300E-7FG456C.

Datasheets:

PCN Obsolescence/ EOL:

PCN Design/Specification:

XCV300E-7FG456C Overview


There is a 456-BBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 312 I/Os are available for transferring data more efficiently. A fundamental building block consists of 6912 logic elements/cells. It is powered from a supply voltage of 1.8V. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.71V~1.89V is needed in order for fpga chips to operate. As part of the Virtex®-E series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. The device has 312 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 456. There are 131072 RAM bits that are available with this device. In order to find related parts, you can use its base part number XCV300E. There is a maximum RAM si16kBe of 16kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 456 pins that are designed for it. 1536 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.8V supply voltage. There are 411955 gates that make up its basic building block. As far as the pin count is concerned, it has 456 pins. Usually, fpga semiconductor uses a 400MHz crystal. 82944 equivalent gates are used to implement the design in the FPGA.

XCV300E-7FG456C Features


312 I/Os
Up to 131072 RAM bits
456 LABs/CLBs


XCV300E-7FG456C Applications


There are a lot of Xilinx Inc.
XCV300E-7FG456C FPGAs applications.


  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding

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