XCV300E-6FGG256C-AMD-Price, Stock & Datasheet

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XCV300E-6FGG256C Information

AMD XCV300E-6FGG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV300E-6FGG256C.

Type
Parameter

Package / Case
FBGA

Surface Mount
YES

JESD-609 Code
e1

Pbfree Code
yes

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
256

ECCN Code
EAR99

Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Max Operating Temperature
85°C

Min Operating Temperature
0°C

Type
Parameter

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
260

Supply Voltage
1.8V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
256

Download datasheets and manufacturer documentation for AMD XCV300E-6FGG256C.

XCV300E-6FGG256C Overview

The package that contains this software is called FBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. A device such as this one has 176 outputs built into it. In total, it has a total of 256 terminations. For the program to work properly, the RAM si16kBe of this FPGA module must reach 16kB GB in order to ensure normal operation. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. A total of 256 pins are included in this device. Most of the time, it uses a crystal oscillating at 357MHz to generate the signal. The FPGA implements the design using 82944 equivalent gates.

XCV300E-6FGG256C Features

85°C gates

XCV300E-6FGG256C Applications

There are a lot of Xilinx
XCV300E-6FGG256C FPGAs applications.

Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics

XCV300E-6FGG256C Relevant information

XCV300E-6FGG256C FAQ

Can I request a quote for XCV300E-6FGG256C?

XCV300E-6FGG256C from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.

Why is pricing not shown as a fixed value for XCV300E-6FGG256C?

The final price for XCV300E-6FGG256C depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.

Which specifications should I review for XCV300E-6FGG256C?

XCV300E-6FGG256C is a AMD electronic component part. Key details include Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 3 (168 Hours); contact us if you need the specifications verified before sourcing.

When will I receive a quotation for XCV300E-6FGG256C?

After you submit the RFQ for XCV300E-6FGG256C, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.

What is the expected shipping time for XCV300E-6FGG256C?

Once stock for XCV300E-6FGG256C is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.

Can AIChipLink help find alternatives to XCV300E-6FGG256C?

Yes. If XCV300E-6FGG256C is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.

AMD XCV300E-6FGG256C

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