AMD XCV300-5BG432C

Manufacturer No:

XCV300-5BG432C

Manufacturer:

AMD

Package:

432-LBGA Exposed Pad, Metal

Description:

1.7mm mm FPGAs Virtex® Series 432-LBGA Exposed Pad, Metal 1.27mm mm 432

Quantity:

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In Stock :Available

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XCV300-5BG432C information

AMD XCV300-5BG432C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV300-5BG432C.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
432-LBGA Exposed Pad, Metal

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Virtex®

Published
2002

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
432

ECCN Code
EAR99

Terminal Finish
Tin/Lead (Sn63Pb37)

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Voltage - Supply
2.375V~2.625V

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
2.5V

Terminal Pitch
1.27mm

Reach Compliance Code
not_compliant

Base Part Number
XCV300

Pin Count
432

JESD-30 Code
S-PBGA-B432

Number of Outputs
316

Qualification Status
Not Qualified

Power Supplies
1.2/3.62.5V

Number of I/O
316

RAM Size
8kB

Clock Frequency
294MHz

Number of Inputs
316

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells
6912

Total RAM Bits
65536

Number of Gates
322970

Number of LABs/CLBs
1536

Combinatorial Delay of a CLB-Max
0.7 ns

Length
40mm

Height Seated (Max)
1.7mm

Width
40mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCV300-5BG432C.

Datasheets:

xilinxinc-xcv1004pq240c-datasheets-8488.pdf

PCN Obsolescence/ EOL:

xilinxinc-xcs053vq100c-pcnobsolescenceeol-8031.pdf

XCV300-5BG432C Overview

Fpga chips is supplied in the 432-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 316 I/Os for transferring data in a more coherent manner. There are 6912 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 316 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 432 terminations. The RAM bits that this device offer is 65536. Its base part number XCV300 can be used to find related parts. The RAM si8kBe of this FPGA module reaches 8kB to ensure normal operation of the program. This FPGA is built as an array of 1536 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 322970 gates. Fpga semiconductor is equipped wfpga semiconductorh 432 pin count. Typically, fpga semiconductor uses a crystal oscillating at 294MHz .

XCV300-5BG432C Features

316 I/Os
Up to 65536 RAM bits

XCV300-5BG432C Applications

There are a lot of Xilinx Inc.
XCV300-5BG432C FPGAs applications.

Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition

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