AMD XCV300-5BG352I
AMD XCV300-5BG352I

AMD XCV300-5BG352I

Manufacturer No:

XCV300-5BG352I

Manufacturer:

AMD

Package:

352-LBGA Exposed Pad, Metal

Description:

FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCV300-5BG352I information

AMD XCV300-5BG352I technical specifications, attributes, parameters and parts with similar specifications to AMD XCV300-5BG352I.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 352-LBGA Exposed Pad, Metal
  • Supplier Device Package
  • 352-MBGA (35x35)
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®
  • Published
  • 2002
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Max Operating Temperature
  • 100°C
  • Min Operating Temperature
  • -40°C
  • Voltage - Supply
  • 2.375V~2.625V
  • Base Part Number
  • XCV300
  • Number of I/O
  • 260
  • RAM Size
  • 8kB
  • Number of Logic Elements/Cells
  • 6912
  • Total RAM Bits
  • 65536
  • Number of Gates
  • 322970
  • Number of LABs/CLBs
  • 1536
  • Number of Logic Blocks (LABs)
  • 1536
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV300-5BG352I.

Datasheets:

PCN Obsolescence/ EOL:

XCV300-5BG352I Overview


In the 352-LBGA Exposed Pad, Metal package, you will find fpga chips. The device has 260 I/O ports for more coherent data transfer. To form a fundamental building block, there are 6912 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. The Virtex® Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 65536 bFpga chipss. You can find related parts by using the part number XCV300, which is its base part number. It is crucial that the RAM si8kBe of this FPGA module reaches 8kB so that the program can run normally. A total of 1536 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. As a result of the design of this module, the maximum operating temperature reaches 100°C. There should be a temperature difference between -40°C and the operating temperature. There are 322970 gates in its basic building block. A basic building block of this system consists of 1536 logic blocks (LABs). Its supplier package is called 352-MBGA (35x35).

XCV300-5BG352I Features


260 I/Os
Up to 65536 RAM bits
100°C gates
1536 logic blocks (LABs)


XCV300-5BG352I Applications


There are a lot of Xilinx Inc.
XCV300-5BG352I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense

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