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AMD XCV200E-7BG352I
Manufacturer No:
XCV200E-7BG352I
Manufacturer:
AMD
Package:
352-LBGA Exposed Pad, Metal
Description:
1.8V V FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 352
Quantity:
In Stock :1668
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
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Shipped from：HK Warehouse
Expected Shipping：Wed, Jul 1 - Thu, Jul 2, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCV200E-7BG352I Information
AMD XCV200E-7BG352I technical specifications, attributes, parameters and parts with similar specifications to AMD XCV200E-7BG352I.
- Type
- Parameter
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Virtex®-E
- Published
- 2006
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Obsolete
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 352
- ECCN Code
- 3A991.D
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 1.71V~1.89V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
Download datasheets and manufacturer documentation for AMD XCV200E-7BG352I.
Datasheets:
PCN Obsolescence/ EOL:
XCV200E-7BG352I Overview
In the 352-LBGA Exposed Pad, Metal package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 260 I/O ports for more coherent data transfer. To form a fundamental building block, there are 5292 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.8V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. The Virtex®-E Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. A total of 260 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 352 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 114688 bFpga chipss. You can find related parts by using the part number XCV200E, which is its base part number. It is crucial that the RAM si14kBe of this FPGA module reaches 14kB so that the program can run normally. A total of 1176 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.8V. There are 306393 gates in its basic building block. With a total of 352 pins, it is equipped with a high level of security. It usually uses a 400MHz crystal. This design is implemented using 63504 equivalent gates on the FPGA.
XCV200E-7BG352I Features
260 I/Os
Up to 114688 RAM bits
XCV200E-7BG352I Applications
There are a lot of Xilinx Inc.
XCV200E-7BG352I FPGAs applications.
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
XCV200E-7BG352I FAQ
Can I request a quote for XCV200E-7BG352I?
XCV200E-7BG352I from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for XCV200E-7BG352I?
The final price for XCV200E-7BG352I depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for XCV200E-7BG352I?
XCV200E-7BG352I is a AMD electronic component part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 3 (168 Hours); contact us if you need the specifications verified before sourcing.
When will I receive a quotation for XCV200E-7BG352I?
After you submit the RFQ for XCV200E-7BG352I, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for XCV200E-7BG352I?
Once stock for XCV200E-7BG352I is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to XCV200E-7BG352I?
Yes. If XCV200E-7BG352I is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.
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