AMD XCV200E-6BG352C
AMD XCV200E-6BG352C

AMD XCV200E-6BG352C

Manufacturer No:

XCV200E-6BG352C

Manufacturer:

AMD

Package:

352-LBGA Exposed Pad, Metal

Description:

1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCV200E-6BG352C information

AMD XCV200E-6BG352C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV200E-6BG352C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 352-LBGA Exposed Pad, Metal
  • Number of I/Os
  • 260
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®-E
  • Published
  • 2006
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 352
  • ECCN Code
  • 3A991.D
  • HTS Code
  • 8542.39.00.01
  • Voltage - Supply
  • 1.71V~1.89V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 1.8V
  • Terminal Pitch
  • 1.27mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XCV200E
  • Pin Count
  • 352
  • Number of Outputs
  • 260
  • Operating Supply Voltage
  • 1.8V
  • RAM Size
  • 14kB
  • Clock Frequency
  • 357MHz
  • Number of Inputs
  • 260
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 5292
  • Total RAM Bits
  • 114688
  • Number of Gates
  • 306393
  • Number of LABs/CLBs
  • 1176
  • Speed Grade
  • 6
  • Combinatorial Delay of a CLB-Max
  • 0.47 ns
  • Length
  • 35mm
  • Height Seated (Max)
  • 1.7mm
  • Width
  • 35mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV200E-6BG352C.

XCV200E-6BG352C Overview


This package is included in the 352-LBGA Exposed Pad, Metal package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Logic elements/cells form the fundamental building block of a computer. 1.8V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.71V~1.89V . An FPGA belonging to the Virtex®-E series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 260 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 352. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. Parts related to this part can be found using its base part number XCV200E. During the configuration of this FPGA module, the RAM si14kBe reaches 14kB to ensure that the program runs normally. An array of 1176 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 306393 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. A crystal oscillating at 357MHz is one of the most common components of this device.

XCV200E-6BG352C Features


Up to 114688 RAM bits


XCV200E-6BG352C Applications


There are a lot of Xilinx Inc.
XCV200E-6BG352C FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio

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