AMD XCV2000E-7FG1156C
AMD XCV2000E-7FG1156C

AMD XCV2000E-7FG1156C

Manufacturer No:

XCV2000E-7FG1156C

Manufacturer:

AMD

Package:

1156-BBGA

Description:

1.8V V 2.6mm mm FPGAs Virtex®-E Series 1156-BBGA 1mm mm

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
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In Stock :Available

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XCV2000E-7FG1156C information

AMD XCV2000E-7FG1156C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV2000E-7FG1156C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 1156-BBGA
  • Number of Pins
  • 1156
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®-E
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • ECCN Code
  • EAR99
  • Terminal Finish
  • TIN LEAD
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.71V~1.89V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Supply Voltage
  • 1.8V
  • Terminal Pitch
  • 1mm
  • Base Part Number
  • XCV2000E
  • Number of Outputs
  • 804
  • Number of I/O
  • 804
  • RAM Size
  • 80kB
  • Clock Frequency
  • 400MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 43200
  • Total RAM Bits
  • 655360
  • Number of Gates
  • 2541952
  • Number of LABs/CLBs
  • 9600
  • Speed Grade
  • 7
  • Combinatorial Delay of a CLB-Max
  • 0.42 ns
  • Number of Equivalent Gates
  • 518400
  • Length
  • 35mm
  • Height Seated (Max)
  • 2.6mm
  • Width
  • 35mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV2000E-7FG1156C.

XCV2000E-7FG1156C Overview


In the package 1156-BBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 804 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 43200 logic elements/cells. Supply voltage is 1.8V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 804 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 655360 bfpga electronics s of RAM. XCV2000E is the base part number that can be used to identify related parts. The RAM si80kBe of this FPGA module reaches 80kB so as to guarantee the normal operation of the program during operation. The device has 1156 pins which are included in the design. The FPGA is built as an array of 9600 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 2541952 gates. Fpga semiconductor typically uses a crystal oscillating at 400MHz. There are 518400 equivalent gates implemented by the FPGA in order to implement the design.

XCV2000E-7FG1156C Features


804 I/Os
Up to 655360 RAM bits
1156 LABs/CLBs


XCV2000E-7FG1156C Applications


There are a lot of Xilinx Inc.
XCV2000E-7FG1156C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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