AMD XCV150-6BG352C

Manufacturer No:

XCV150-6BG352C

Manufacturer:

AMD

Package:

352-LBGA Exposed Pad, Metal

Description:

1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

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XCV150-6BG352C information

AMD XCV150-6BG352C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV150-6BG352C.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
352-LBGA Exposed Pad, Metal

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Virtex®

Published
2000

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
352

ECCN Code
EAR99

Terminal Finish
Tin/Lead (Sn63Pb37)

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Voltage - Supply
2.375V~2.625V

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
2.5V

Terminal Pitch
1.27mm

Reach Compliance Code
not_compliant

Base Part Number
XCV150

Pin Count
352

JESD-30 Code
S-PBGA-B352

Number of Outputs
260

Qualification Status
Not Qualified

Power Supplies
1.2/3.62.5V

Number of I/O
260

RAM Size
6kB

Clock Frequency
333MHz

Number of Inputs
260

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells
3888

Total RAM Bits
49152

Number of Gates
164674

Number of LABs/CLBs
864

Combinatorial Delay of a CLB-Max
0.6 ns

Number of CLBs
864

Length
35mm

Height Seated (Max)
1.7mm

Width
35mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCV150-6BG352C.

Datasheets:

xilinxinc-xcv1004pq240c-datasheets-8488.pdf

PCN Obsolescence/ EOL:

xilinxinc-xcs053vq100c-pcnobsolescenceeol-8031.pdf

XCV150-6BG352C Overview

Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 3888 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 49152. Its base part number XCV150 can be used to find related parts. The RAM si6kBe of this FPGA module reaches 6kB to ensure normal operation of the program. This FPGA is built as an array of 864 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 164674 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 333MHz . 864 CLBs are basic modules used for its architecture.

XCV150-6BG352C Features

260 I/Os
Up to 49152 RAM bits

XCV150-6BG352C Applications

There are a lot of Xilinx Inc.
XCV150-6BG352C FPGAs applications.

Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition

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