AMD XCV1000E-6BG560C

Manufacturer No:

XCV1000E-6BG560C

Manufacturer:

AMD

Package:

560-LBGA Exposed Pad, Metal

Description:

1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

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XCV1000E-6BG560C information

AMD XCV1000E-6BG560C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV1000E-6BG560C.

Type
Parameter

Mount
Surface Mount

Mounting Type
Surface Mount

Package / Case
560-LBGA Exposed Pad, Metal

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Virtex®-E

Published
1999

JESD-609 Code
e0

Pbfree Code
no

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
560

ECCN Code
3A991.D

HTS Code
8542.39.00.01

Subcategory
Field Programmable Gate Arrays

Technology
CMOS

Voltage - Supply
1.71V~1.89V

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
1.8V

Terminal Pitch
1.27mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XCV1000E

Number of Outputs
404

Operating Supply Voltage
1.8V

Number of I/O
404

RAM Size
48kB

Clock Frequency
357MHz

Number of Inputs
404

Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells
27648

Total RAM Bits
393216

Number of Gates
1569178

Number of LABs/CLBs
6144

Speed Grade
6

Combinatorial Delay of a CLB-Max
0.47 ns

Length
42.5mm

Height Seated (Max)
1.7mm

Width
42.5mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCV1000E-6BG560C.

Datasheets:

xilinxinc-xcv1000e6fg1156i-datasheets-8619.pdf

PCN Obsolescence/ EOL:

xilinxinc-xc17v01vo8c-pcnobsolescenceeol-2409.pdf

XCV1000E-6BG560C Overview

The package that contains this software is called 560-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 404 I/Os for better data transfer. In order to construct a fundamental building block, 27648 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.71V~1.89V battery. There are many types of FPGAs in the Virtex®-E series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 404 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 393216. If you are looking for related parts, you can use the base part number XCV1000E as a starting point. For the program to work properly, the RAM si48kBe of this FPGA module must reach 48kB GB in order to ensure normal operation. 6144 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. As a basic building block, fpga semiconductor consists of 1569178 gates. A total of 560 pins are included in this device. Most of the time, it uses a crystal oscillating at 357MHz to generate the signal.

XCV1000E-6BG560C Features

404 I/Os
Up to 393216 RAM bits

XCV1000E-6BG560C Applications

There are a lot of Xilinx Inc.
XCV1000E-6BG560C FPGAs applications.

Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics

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