AMD XCV100-5BG256C
AMD XCV100-5BG256C

AMD XCV100-5BG256C

Manufacturer No:

XCV100-5BG256C

Manufacturer:

AMD

Package:

256-BBGA

Description:

2.5V V FPGAs Virtex® Series 256-BBGA 1.27mm mm 256

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCV100-5BG256C information

AMD XCV100-5BG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV100-5BG256C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 256-BBGA
  • Number of Pins
  • 256
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®
  • Published
  • 2002
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 256
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Tin/Lead (Sn63Pb37)
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 2.375V~2.625V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 2.5V
  • Terminal Pitch
  • 1.27mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 256
  • Number of Outputs
  • 180
  • Operating Supply Voltage
  • 2.5V
  • Number of I/O
  • 180
  • RAM Size
  • 5kB
  • Clock Frequency
  • 294MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 2700
  • Total RAM Bits
  • 40960
  • Number of Gates
  • 108904
  • Number of LABs/CLBs
  • 600
  • Speed Grade
  • 5
  • Combinatorial Delay of a CLB-Max
  • 0.7 ns
  • Number of CLBs
  • 600
  • Length
  • 27mm
  • Width
  • 27mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV100-5BG256C.

XCV100-5BG256C Overview


In the package 256-BBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 180 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 2700 logic elements/cells. Supply voltage is 2.5V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 180 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 256. Fpga electronics is worth mentioning that this device provides 40960 bfpga electronics s of RAM. XCV100 is the base part number that can be used to identify related parts. The RAM si5kBe of this FPGA module reaches 5kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. The FPGA is built as an array of 600 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 2.5V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 108904 gates. I am going to present you with a device that is equipped with 256 pins. Fpga semiconductor typically uses a crystal oscillating at 294MHz. The architecture of the system is based on 600 CLBs.

XCV100-5BG256C Features


180 I/Os
Up to 40960 RAM bits
256 LABs/CLBs


XCV100-5BG256C Applications


There are a lot of Xilinx Inc.
XCV100-5BG256C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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