AMD XCV100-4BG256I
AMD XCV100-4BG256I

AMD XCV100-4BG256I

Manufacturer No:

XCV100-4BG256I

Manufacturer:

AMD

Package:

256-BBGA

Description:

2.55mm mm FPGAs Virtex® Series 256-BBGA 1.27mm mm 256

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCV100-4BG256I information

AMD XCV100-4BG256I technical specifications, attributes, parameters and parts with similar specifications to AMD XCV100-4BG256I.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 256-BBGA
  • Number of Pins
  • 256
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®
  • Published
  • 2000
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 256
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Tin/Lead (Sn63Pb37)
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 2.375V~2.625V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 2.5V
  • Terminal Pitch
  • 1.27mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XCV100
  • Pin Count
  • 256
  • Number of Outputs
  • 180
  • Qualification Status
  • Not Qualified
  • Power Supplies
  • 1.5/3.32.5V
  • Number of I/O
  • 180
  • RAM Size
  • 5kB
  • Clock Frequency
  • 250MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 2700
  • Total RAM Bits
  • 40960
  • Number of Gates
  • 108904
  • Number of LABs/CLBs
  • 600
  • Combinatorial Delay of a CLB-Max
  • 0.8 ns
  • Number of CLBs
  • 600
  • Length
  • 27mm
  • Height Seated (Max)
  • 2.55mm
  • Width
  • 27mm
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

XCV100-4BG256I Overview


In the 256-BBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 180 I/O ports for more coherent data transfer. To form a fundamental building block, there are 2700 logic elements/cells. In order to operate fpga chips, a voltage supply of 2.5V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. The Virtex® Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. A total of 180 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 256 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 40960 bFpga chipss. You can find related parts by using the part number XCV100, which is its base part number. It is crucial that the RAM si5kBe of this FPGA module reaches 5kB so that the program can run normally. In order to make it work, 256 pins have been designed. A total of 600 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. There is a 1.5/3.32.5V power supply that is required to operate it. There are 108904 gates in its basic building block. With a total of 256 pins, it is equipped with a high level of security. It usually uses a 250MHz crystal. For its architecture, 600 CLB modules are used.

XCV100-4BG256I Features


180 I/Os
Up to 40960 RAM bits
256 LABs/CLBs


XCV100-4BG256I Applications


There are a lot of Xilinx Inc.
XCV100-4BG256I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense

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Step4:Individual Package

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