

AMD XCR3512XL-10FTG256I
Manufacturer No:
XCR3512XL-10FTG256I
Manufacturer:
Package:
256-LBGA
Description:
1mm PMIC CoolRunner XPLA3 Series 256 Pin 3.3V 256-LBGA
Quantity:
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XCR3512XL-10FTG256I Information
AMD XCR3512XL-10FTG256I technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3512XL-10FTG256I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- CoolRunner XPLA3
- Published
- 1996
- JESD-609 Code
- e1
- Type
- Parameter
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
Download datasheets and manufacturer documentation for AMD XCR3512XL-10FTG256I.
Datasheets:
Environmental Information:
XCR3512XL-10FTG256I Overview
There are 512 macro cells. A macro cell is a cell in a mobile phone network that provides radio coverage through the use of a high-power cell site (tower, antenna or mast).It is contained in package [0].The device is programmed with 212 I/Os.Devices are programmed with terminations of 256.This electrical part has a terminal position of BOTTOM, which serves as an important point of access for passengers and freight.The power supply voltage is 3.3V.There is a part included in Programmable Logic Devices.Tray is the packaging method.To ensure reliability, the device operates at a temperature of -40°C~85°C TA.It is recommended that the chip be mounted by Surface Mount.As part of the CoolRunner XPLA3 series, it is a type of FPGA.256 pins are programmed on the chip.This device is also capable of displaying YES.As a building block for digital circuits, there are 12000 gates.A high level of efficiency can be achieved by maintaining the supply voltage at 3.3V.Data is stored using EEPROM.Surface Mount is used to mount this electronic component.A total of 256 pins are provided on this board.3.6V is the maximum supply voltage (Vsup).There should be a lower maximum frequency than 97MHz.A fundamental building block consists of 32 logic elements/cells.
XCR3512XL-10FTG256I Features
256-LBGA package
212 I/Os
The operating temperature of -40°C~85°C TA
256 pin count
256 pins
XCR3512XL-10FTG256I Applications
There are a lot of Xilinx Inc.
XCR3512XL-10FTG256I CPLDs applications.
- Timing control
- Interface bridging
- I/O expansion
- Discrete logic functions
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
- Handheld digital devices
XCR3512XL-10FTG256I Relevant information
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