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AMD XCKU3P-2FFVB676I
Manufacturer No:
XCKU3P-2FFVB676I
Manufacturer:
AMD
Package:
676-BBGA, FCBGA
Description:
FPGAs Kintex® UltraScale+? Series 676-BBGA, FCBGA
Quantity:
In Stock :6554
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Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Tue, Jun 2 - Wed, Jun 3, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
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PURCHASE
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCKU3P-2FFVB676I Information
AMD XCKU3P-2FFVB676I technical specifications, attributes, parameters and parts with similar specifications to AMD XCKU3P-2FFVB676I.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 676-BBGA, FCBGA
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Kintex® UltraScale+?
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.39.00.01
- Voltage - Supply
- 0.825V~0.876V
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 280
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 355950
- Total RAM Bits
- 31641600
- Number of LABs/CLBs
- 20340
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCKU3P-2FFVB676I.
Datasheets:
Environmental Information:
XCKU3P-2FFVB676I Overview
In the 676-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 280 I/O ports for more coherent data transfer. To form a fundamental building block, there are 355950 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. The Kintex® UltraScale+? Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 31641600 bFpga chipss. A total of 20340 LABs/CLBs are included in this FPGA.
XCKU3P-2FFVB676I Features
280 I/Os
Up to 31641600 RAM bits
XCKU3P-2FFVB676I Applications
There are a lot of Xilinx Inc.
XCKU3P-2FFVB676I FPGAs applications.
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
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