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AMD XCKU3P-2FFVB676E
Manufacturer No:
XCKU3P-2FFVB676E
Manufacturer:
AMD
Package:
676-BBGA, FCBGA
Description:
FPGAs Kintex® UltraScale+? Series 676-BBGA, FCBGA
Quantity:
In Stock :8856
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Wed, Jun 3 - Thu, Jun 4, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
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PURCHASE
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCKU3P-2FFVB676E Information
AMD XCKU3P-2FFVB676E technical specifications, attributes, parameters and parts with similar specifications to AMD XCKU3P-2FFVB676E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 676-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Kintex® UltraScale+?
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Type
- Parameter
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.39.00.01
- Voltage - Supply
- 0.825V~0.876V
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 280
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 355950
- Total RAM Bits
- 31641600
- Number of LABs/CLBs
- 20340
Download datasheets and manufacturer documentation for AMD XCKU3P-2FFVB676E.
Datasheets:
Environmental Information:
XCKU3P-2FFVB676E Overview
The package that contains this software is called 676-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 280 I/Os for better data transfer. In order to construct a fundamental building block, 355950 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.825V~0.876V battery. There are many types of FPGAs in the Kintex® UltraScale+? series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 31641600. 20340 LABs/CLBs are configured on this FPGA.
XCKU3P-2FFVB676E Features
280 I/Os
Up to 31641600 RAM bits
XCKU3P-2FFVB676E Applications
There are a lot of Xilinx Inc.
XCKU3P-2FFVB676E FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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12.28 M
Listed Part Number
3,000+
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4.9 M
In-stock SKU
15,000+
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