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AMD XCKU085-2FLVB1760I
Manufacturer No:
XCKU085-2FLVB1760I
Manufacturer:
Package:
1760-BBGA, FCBGA
Description:
950mV V 3.71mm mm FPGAs Kintex® UltraScale? Series 1760-BBGA, FCBGA 1mm mm
Quantity:
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XCKU085-2FLVB1760I Information
AMD XCKU085-2FLVB1760I technical specifications, attributes, parameters and parts with similar specifications to AMD XCKU085-2FLVB1760I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 1760-BBGA, FCBGA
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Kintex® UltraScale?
- Published
- 2012
- Part Status
- Active
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- ECCN Code
- 3A001.A.7.B
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 0.922V~0.979V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 0.95V
- Terminal Pitch
- 1mm
Download datasheets and manufacturer documentation for AMD XCKU085-2FLVB1760I.
Datasheets:
Environmental Information:
XCKU085-2FLVB1760I Description
The XCKU085-2FLVB1760I is a Xilinx® UltraScale? architecture that comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.
XCKU085-2FLVB1760I Features
Operating Temperature?-40°C~100°C TJ
Kintex® UltraScale? Series
Field Programmable Gate Arrays
XCKU085-2FLVB1760I Applications
Industrial
XCKU085-2FLVB1760I Relevant information
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