AMD XCKU040-1FBVA900C
Manufacturer No:
XCKU040-1FBVA900C
Manufacturer:
Package:
900-BBGA, FCBGA
Description:
950mV V 2.8mm mm FPGAs Kintex® UltraScale? Series 900-BBGA, FCBGA 900
Quantity:
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XCKU040-1FBVA900C Information
AMD XCKU040-1FBVA900C technical specifications, attributes, parameters and parts with similar specifications to AMD XCKU040-1FBVA900C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 900-BBGA, FCBGA
- Surface Mount
- YES
- Number of Pins
- 900
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Bulk
- Series
- Kintex® UltraScale?
- Published
- 2011
- JESD-609 Code
- e1
- Type
- Parameter
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 900
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Subcategory
- Field Programmable Gate Arrays
- Packing Method
- TRAY
- Technology
- CMOS
- Voltage - Supply
- 0.922V~0.979V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
Download datasheets and manufacturer documentation for AMD XCKU040-1FBVA900C.
Datasheets:
Environmental Information:
XCKU040-1FBVA900C Overview
In the package 900-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 468 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 530250 logic elements/cells. Supply voltage is 0.95V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.922V~0.979V, this device operates with ease. This is a type of FPGA that is part of the Kintex® UltraScale? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 468 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Bulk. In total, the terminations of this piece are 900. Fpga electronics is worth mentioning that this device provides 21606000 bfpga electronics s of RAM. The RAM si2.6MBe of this FPGA module reaches 2.6MB so as to guarantee the normal operation of the program during operation. The device has 900 pins which are included in the design. The FPGA is built as an array of 30300 latches or CLBs. In operation with 950mV, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 0.95V. The structure of the registers used to store and transfer data consists of 484800 registers. It uses a packing method TRAY, which is suitable for most industrial design purposes.
XCKU040-1FBVA900C Features
468 I/Os
Up to 21606000 RAM bits
900 LABs/CLBs
484800 registers
XCKU040-1FBVA900C Applications
There are a lot of Xilinx Inc.
XCKU040-1FBVA900C FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
XCKU040-1FBVA900C Relevant information
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