AMD XC7Z045-2FFG900E
Manufacturer No:
XC7Z045-2FFG900E
Manufacturer:
Package:
900-BBGA, FCBGA
Description:
900 Terminations 0°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
Quantity:
Delivery:
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In Stock :Available
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XC7Z045-2FFG900E information
AMD XC7Z045-2FFG900E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z045-2FFG900E.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Package / Case
- 900-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq®-7000
- Published
- 2009
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 900
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code
- 8542.39.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 245
- Supply Voltage
- 1V
- Terminal Pitch
- 1mm
- Frequency
- 800MHz
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- XC7Z045
- Operating Supply Voltage
- 1V
- Supply Voltage-Max (Vsup)
- 1.05V
- Interface
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O
- 130
- RAM Size
- 256KB
- Memory Type
- ROMless
- Core Processor
- Dual ARM® Cortex®-A9 MPCore? with CoreSight?
- Peripherals
- DMA
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Data Bus Width
- 32b
- Core Architecture
- ARM
- Boundary Scan
- YES
- Speed Grade
- -2
- RAM (words)
- 256000
- Primary Attributes
- Kintex?-7 FPGA, 350K Logic Cells
- Bus Compatibility
- CAN; ETHERNET; I2C; SPI; UART; USB
- Length
- 31mm
- Height Seated (Max)
- 3.35mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC7Z045-2FFG900E.
Datasheets:
Environmental Information:
PCN Design/Specification:
PCN Assembly/Origin:
PCN Packaging:
This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Kintex?-7 FPGA, 350K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a result, there are 900 terminations in total, which does really benefit system on a chip.XC7Z045 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900E System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
User Guide
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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