AMD XC7Z045-1FFG676C
Manufacturer No:
XC7Z045-1FFG676C
Manufacturer:
Package:
676-BBGA, FCBGA
Description:
676 Terminations 0°C~85°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V
Quantity:
Delivery:
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In Stock :Available
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XC7Z045-1FFG676C information
AMD XC7Z045-1FFG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z045-1FFG676C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Package / Case
- 676-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Zynq®-7000
- Published
- 2009
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 676
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.39.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 245
- Supply Voltage
- 1V
- Terminal Pitch
- 1mm
- Frequency
- 667MHz
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- XC7Z045
- Operating Supply Voltage
- 1V
- Supply Voltage-Max (Vsup)
- 1.05V
- Interface
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O
- 130
- RAM Size
- 256KB
- Memory Type
- ROMless
- Core Processor
- Dual ARM® Cortex®-A9 MPCore? with CoreSight?
- Peripherals
- DMA
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Data Bus Width
- 32b
- Core Architecture
- ARM
- Boundary Scan
- YES
- Speed Grade
- -1
- RAM (words)
- 256000
- Primary Attributes
- Kintex?-7 FPGA, 350K Logic Cells
- Bus Compatibility
- CAN; ETHERNET; I2C; SPI; UART; USB
- Length
- 27mm
- Height Seated (Max)
- 3.37mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC7Z045-1FFG676C.
Datasheets:
Environmental Information:
PCN Design/Specification:
PCN Assembly/Origin:
PCN Packaging:
This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight? is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines Kintex?-7 FPGA, 350K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, so system on a chip is really aided by this.A search for XC7Z045 will result in system on chips that have similar specs and purposes.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FFG676C System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
User Guide
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
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