Xilinx XC7Z045-1FBG676C
Xilinx XC7Z045-1FBG676C

Xilinx XC7Z045-1FBG676C

Manufacturer No:

XC7Z045-1FBG676C

Manufacturer:

Xilinx

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~85°C TJ 676 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V Min 1.2V V Max 3.3V V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC7Z045-1FBG676C information

Xilinx XC7Z045-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx XC7Z045-1FBG676C.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Contact Plating
  • Copper, Silver, Tin
  • Package / Case
  • 676-BBGA, FCBGA
  • Surface Mount
  • YES
  • Number of Pins
  • 676
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq®-7000
  • Published
  • 2009
  • JESD-609 Code
  • e1
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 676
  • ECCN Code
  • 3A991.D
  • Terminal Finish
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
  • 8542.39.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 245
  • Supply Voltage
  • 1V
  • Terminal Pitch
  • 1mm
  • Frequency
  • 667MHz
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Interface
  • CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Max Supply Voltage
  • 3.3V
  • Min Supply Voltage
  • 1.2V
  • Number of I/O
  • 130
  • RAM Size
  • 256KB
  • Memory Type
  • ROMless
  • Core Processor
  • Dual ARM® Cortex®-A9 MPCore? with CoreSight?
  • Peripherals
  • DMA
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Data Bus Width
  • 32b
  • Number of Logic Elements/Cells
  • 190000
  • Core Architecture
  • ARM
  • Boundary Scan
  • YES
  • Speed Grade
  • -1
  • RAM (words)
  • 256000
  • Primary Attributes
  • Kintex?-7 FPGA, 350K Logic Cells
  • Bus Compatibility
  • CAN; ETHERNET; I2C; SPI; UART; USB
  • Length
  • 27mm
  • Height Seated (Max)
  • 2.54mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for Xilinx XC7Z045-1FBG676C.

Datasheets:

Environmental Information:

PCN Design/Specification:

PCN Assembly/Origin:

PCN Packaging:

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.It is really beneficial to have system on a chip since there are 676 terminations in total.By searching XC7Z045, you can find system on chips with similar specs and purposes.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.676 pins are present on this computer SoC.Voltage of maximum supply is 3.3V.The SoC security is powered at least by 1.2V.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z045-1FBG676C System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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Step2：Desiccant Protection

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Step4：Individual Package

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Step5：Anti-collision Filling

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

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