AMD XC7Z045-1FBG676C

Manufacturer No:

XC7Z045-1FBG676C

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~85°C TJ 676 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V Min 1.2V V Max 3.3V V

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XC7Z045-1FBG676C information

AMD XC7Z045-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z045-1FBG676C.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
676-BBGA, FCBGA

Surface Mount
YES

Number of Pins
676

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2009

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
676

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
245

Supply Voltage
1V

Terminal Pitch
1mm

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
30

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Max Supply Voltage
3.3V

Min Supply Voltage
1.2V

Number of I/O
130

RAM Size
256KB

Memory Type
ROMless

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Number of Logic Elements/Cells
190000

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
-1

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 350K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
27mm

Height Seated (Max)
2.54mm

Radiation Hardening
No

RoHS Status
ROHS3 Compliant

Download datasheets and manufacturer documentation for AMD XC7Z045-1FBG676C.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

There are Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processors in this SoC.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 130 I/Os.A power supply with a 1V rating is recommended.It is really beneficial to have system on a chip since there are 676 terminations in total.By searching XC7Z045, you can find system on chips with similar specs and purposes.There is 667MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.676 pins are present on this computer SoC.Voltage of maximum supply is 3.3V.The SoC security is powered at least by 1.2V.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-1FBG676C System On Chip (SoC) applications.

Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors
Robotics
Central alarm system

User Guide

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