AMD XC7Z035-3FFG676E
Manufacturer No:
XC7Z035-3FFG676E
Manufacturer:
AMD
Package:
676-BBGA, FCBGA
Description:
676 Terminations 0°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V
Quantity:
In Stock :8586
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Thu, Jul 2 - Fri, Jul 3, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XC7Z035-3FFG676E Information
AMD XC7Z035-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z035-3FFG676E.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Package / Case
- 676-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq®-7000
- Published
- 2010
- JESD-609 Code
- e1
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Type
- Parameter
- Number of Terminations
- 676
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Additional Feature
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- HTS Code
- 8542.39.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 1V
Download datasheets and manufacturer documentation for AMD XC7Z035-3FFG676E.
Datasheets:
Environmental Information:
PCN Design/Specification:
PCN Packaging:
This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Kintex?-7 FPGA, 275K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.As a minimum, the power supply of the SoC system on a chip needs to be 0.95V.As a result, there are 676 terminations in total, which does really benefit system on a chip.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.Moreover, this SoC processor is also equipped with additional features of PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.
Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-3FFG676E System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
XC7Z035-3FFG676E FAQ
Can I request a quote for XC7Z035-3FFG676E?
XC7Z035-3FFG676E from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for XC7Z035-3FFG676E?
The final price for XC7Z035-3FFG676E depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for XC7Z035-3FFG676E?
XC7Z035-3FFG676E is a AMD electronic component part. Key details include Packaging: Tray and Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED and Moisture Sensitivity Level (MSL): 4 (72 Hours); contact us if you need the specifications verified before sourcing.
When will I receive a quotation for XC7Z035-3FFG676E?
After you submit the RFQ for XC7Z035-3FFG676E, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for XC7Z035-3FFG676E?
Once stock for XC7Z035-3FFG676E is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to XC7Z035-3FFG676E?
Yes. If XC7Z035-3FFG676E is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.
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